Enhancing cooling of an electronic heat sink

An electronic device such as a CPU in a computer emits heat due to its thermal resistance. A heat sink is a metal object brought into contact with the electronic device hot surface to absorb the excessive heat. A heat sink usually consists of a metal structure with one or more flat surfaces to ensure good thermal contact with the components to be cooled. A heat sink is sometimes used in conjunction with a fan. The fan generates a jet flow among the metal structure that results in replacing the natural convection with forced convection (i.e. increasing the rate of airflow over the heat sink) and increasing the cooling efficiency (see Fig. 1).Therefore, jet impingement is an effective way of heat removal with respect to electronic applications. It has been shown that when a jet is combined with crossflow, the streamline patterns changes that may affect the heat transfer significantly.


Fig. 1: A heat sink with fan

In this work, we aim to study the effect of by-pass on heat transfer efficiency of a heat sink. For this purpose, the 3D laminar flow in a sharp 180-degree bend is simulated using the LBM scheme.A detailed parametric study by varying the number of bypass openings and the spacing between them is carried out to predict its effect on fluid flow and heat transfer (see Fig. 2).

Fig. 2: Schematic of the computational domain without and with bypass

This project is available from September 2016.

Contact: a.zarghami-1@tudelft.nl

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